Warpage Simulation by the CTE mismatch in Blanket Structured Wafer Level 3D packaging
نویسندگان
چکیده
منابع مشابه
Micro to Macro Thermo - Mechanical Simulation of Wafer Level Packaging
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ژورنال
عنوان ژورنال: Journal of The Korean Society of Manufacturing Technology Engineers
سال: 2013
ISSN: 2508-5093
DOI: 10.7735/ksmte.2013.22.1.168